Packaging and Testing Engineer

Key Responsibilities : 

• Responsible for engineering coordination with packaging factories and testing factories; interface with test suppliers on product test development engineering matters. 
• Manage the NPI process, oversee the design, manufacturing, and testing workflows, and drive yield improvement. Ensure that CP and FT meet mass production standards in terms of manufacturing criteria, yield rate, and test coverage.
• Analyze production anomalies and abnormal products reported by customers, and assist the CQE in providing handling recommendations. 
• Track the progress of engineering batches, coordinate failure analysis for pilot runs, provide improvement plans, and participate in completing product reliability verification. 
• Prepare and control product packaging documents.  

Knowledge and Skill Requirements: 

• Bachelor’s or above in Microelectronics, Semiconductor Physics, Electronic Engineering, or related fields. 
• Over 3 years of experience as a PE or PIE  in wafer fabs or packaging factories, with familiarity in IC manufacturing and packaging processes. Candidates with experience in IC new product project management or design house PE experience are preferred. 
• Familiar with semiconductor quality standards. 
• Strong data analysis and logical reasoning abilities; proficient in common data analysis software; familiar with IC failure analysis methods and tools. 
• Excellent execution, communication, and organizational skills; outstanding coordination capabilities and a good sense of teamwork.
• Fluent in Mandarin and English is preferred.